To study surface morphology of mechanically cleaved mica layers on oxidized silicon /

Abstract

Layered materials are solids with strong intra planar bonds and weak inter planar van der waal bonds. So these materials can be peeled off easily, peeling process is named as, exfoliation yielding 2D materials. 2D materials e.g. WS2, MoS2, graphene etc. are of unique importance owing to their specific properties, and they use for fabrication of new class of electronic devices, flexible electronics, super capacitors and spintronics. Apart from conducting and semiconducting materials, microelectronic industry also needs insulators which can use as substrates, dielectrics and electron tunneling barriers. Mica a dielectric material with high dielectric strength: is important, due to it its high resistance to water, heat and chemical agents, to its mechanical properties. Mica as bendable material used in fabrication of bendable devices. Mica as 2D material has remarkable characteristics; used as coating substance in paints and pigments, as filler it enhances the properties of polymer nanocomposites. Mica is successfully exfoliated by mechanical and by liquid phase exfoliation. Exfoliation is confirmed by XRD, Optical microscope and FTIR analysis. Mica solution as a filler is used in fabrication of PVC nanocomposites for enhancing mechanical properties of PVC composites. PVC composites are fabricated using different ratios of mica solution, by solution blending method. The structural and mechanical properties of these nanocomposites were analyzed by XRD, FTIR and UTM. These techniques confirmed the dispersion and mixing of filler in PVC. UTM analysis investigates that tensile strength increased with mica loading and hence, mechanical properties are increased. This increase suggests the efficient filler matrix reinforcement. Mica/PVC nanocomposites have applications in food packaging, flooring, and sheets in pool construction, smoke resistance and repairing cracks.